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| PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers Rev. 04 -- 15 January 2010 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in small and flat lead Surface Mounted Device (SMD) plastic packages. Table 1. Product overview Package NXP PMEG2020EH PMEG2020EJ SOD123F SOD323F JEITA SC-90 single diode single diode Configuration Type number 1.2 Features Forward current: 2 A Reverse voltage: 20 V Very low forward voltage Small and flat lead SMD plastic package 1.3 Applications Low voltage rectification High efficiency DC-to-DC conversion Switch mode power supply Inverse polarity protection Low power consumption applications 1.4 Quick reference data Table 2. Symbol IF VR VF [1] Quick reference data Parameter forward current reverse voltage forward voltage IF = 2 A [1] Conditions Tsp 55 C Min - Typ 450 Max 2 20 525 Unit A V mV Pulse test: tp 300 s; 0.02. NXP Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 2. Pinning information Table 3. Pin 1 2 Pinning Description cathode anode [1] Simplified outline Symbol 1 2 sym001 1 001aab540 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Ordering information Package Name PMEG2020EH PMEG2020EJ SC-90 Description plastic surface mounted package; 2 leads plastic surface mounted package; 2 leads Version SOD123F SOD323F Type number 4. Marking Table 5. Marking codes Marking code A6 CA Type number PMEG2020EH PMEG2020EJ PMEG2020EH_EJ_4 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 -- 15 January 2010 2 of 10 NXP Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VR IF IFRM IFSM Ptot reverse voltage forward current non-repetitive peak forward current total power dissipation PMEG2020EH PMEG2020EJ Tj Tamb Tstg [1] [2] Conditions Tsp 55 C tp = 8 ms; square wave Tamb 25 C [1] [2] [1] [2] Min - Max 20 2 7 9 Unit V A A A repetitive peak forward current tp 1 ms; 0.5 -65 -65 375 830 360 830 150 +150 +150 mW mW mW mW C C C junction temperature ambient temperature storage temperature Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. 6. Thermal characteristics Table 7. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient PMEG2020EH PMEG2020EJ Rth(j-sp) thermal resistance from junction to solder point PMEG2020EH PMEG2020EJ [1] Conditions in free air [1][2] [1][3] [1][2] [1][3] [4] Min Typ Max Unit - - 330 150 350 150 K/W K/W K/W K/W - - 60 55 K/W K/W For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Nomograms for determining the reverse power losses PR and IF(AV) rating will be available on request. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Soldering point of cathode tab. [2] [3] [4] PMEG2020EH_EJ_4 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 -- 15 January 2010 3 of 10 NXP Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 7. Characteristics Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol VF Parameter forward voltage IF = 0.01 A IF = 0.1 A IF = 1 A IF = 2 A IR reverse current VR = 5 V VR = 10 V VR = 20 V Cd [1] Conditions [1] Min - Typ 200 260 370 450 15 20 45 50 Max 220 290 430 525 50 80 200 60 Unit mV mV mV mV A A A pF diode capacitance VR = 5 V; f = 1 MHz Pulse test: tp 300 s; 0.02. PMEG2020EH_EJ_4 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 -- 15 January 2010 4 of 10 NXP Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 104 IF (mA) 103 006aaa011 IR (mA) 102 10 1 (1) (2) 006aaa012 102 10-1 10-2 (3) 10 (1) (2) (3) (4) 10-3 10-4 1 10-5 10-1 0 0.1 0.2 0.3 0.4 VF (V) 0.5 10-6 0 (4) 5 10 15 VR (V) 20 (1) Tamb = 125 C (2) Tamb = 85 C (3) Tamb = 25 C (4) Tamb = -40 C (1) Tamb = 125 C (2) Tamb = 85 C (3) Tamb = 25 C (4) Tamb = -40 C Fig 1. Forward current as a function of forward voltage; typical values 200 Cd (pF) 150 Fig 2. Reverse current as a function of reverse voltage; typical values 006aaa013 100 50 0 0 5 10 15 VR (V) 20 Tamb = 25 C; f = 1 MHz Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG2020EH_EJ_4 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 -- 15 January 2010 5 of 10 NXP Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 8. Package outline 1.7 1.5 1 0.55 0.35 3.6 3.4 2.7 2.5 2.7 2.3 1.8 1.6 1.2 1.0 1.35 1.15 1 0.5 0.3 0.80 0.65 2 0.70 0.55 Dimensions in mm 0.25 0.10 04-11-29 Dimensions in mm 2 0.40 0.25 0.25 0.10 04-09-13 Fig 4. Package outline SOD123F Fig 5. Package outline SOD323F (SC-90) 9. Packing information Table 9. Packing methods The -xxx numbers are the last three digits of the 12NC ordering code.[1] Type number PMEG2020EH PMEG2020EJ [1] Package SOD123F SOD323F Description 4 mm pitch, 8 mm tape and reel Packing quantity 3000 -115 10000 -135 For further information and the availability of packing methods, see Section 13. PMEG2020EH_EJ_4 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 -- 15 January 2010 6 of 10 NXP Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 10. Soldering 4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2x) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 6. Reflow soldering footprint SOD123F 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2x) msa433 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 7. Reflow soldering footprint SOD323F (SC-90) PMEG2020EH_EJ_4 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 -- 15 January 2010 7 of 10 NXP Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 11. Revision history Table 10. Revision history Release date 20100115 Data sheet status Product data sheet Change notice Supersedes PMEG2020EH_EJ_3 Document ID PMEG2020EH_EJ_4 Modifications: * This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. Product data sheet Product data sheet Preliminary data sheet Product data sheet Preliminary data sheet PMEG2020EH_2 PMEG2020EJ_2 PMEG2020EH_1 PMEG2020EJ_1 - PMEG2020EH_EJ_3 PMEG2020EH_2 PMEG2020EH_1 PMEG2020EJ_2 PMEG2020EJ_1 20050810 20050523 20050304 20050131 20040830 PMEG2020EH_EJ_4 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 -- 15 January 2010 8 of 10 NXP Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 12. Legal information 12.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 12.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PMEG2020EH_EJ_4 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 -- 15 January 2010 9 of 10 NXP Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 January 2010 Document identifier: PMEG2020EH_EJ_4 |
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